Sanhuang electronics (Hong Kong) Co., Limited

Sanhuang Electronics (Hong Kong) Co., Limite

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W949D6DBHX5I IC DRAM 512MBIT PAR 60VFBGA Winbond Electronics

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W949D6DBHX5I IC DRAM 512MBIT PAR 60VFBGA Winbond Electronics

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Brand Name :Winbond Electronics
Model Number :W949D6DBHX5I
MOQ :1
Price :Based on current price
Payment Terms :T/T
Supply Ability :In stock
Delivery Time :3-5 work days
Packaging Details :anti-static bag & cardboard box
Memory Type :Volatile
Memory Format :DRAM
Technology :SDRAM - Mobile LPDDR
Memory Size :512Mbit
Memory Organization :32M x 16
Memory Interface :Parallel
Clock Frequency :200 MHz
Write Cycle Time - Word, Page :15ns
Access Time :5 ns
Voltage - Supply :1.7V ~ 1.95V
Operating Temperature :-40°C ~ 85°C (TA)
Mounting Type :Surface Mount
Package / Case :60-TFBGA
Supplier Device Package :60-VFBGA (8x9)
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Product Details

GENERAL DESCRIPTION

W9425G6DH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR SDRAM), organized as 4,194,304 words × 4 banks × 16 bits. Using pipelined architecture and 0.11 µm process technology, W9425G6DH delivers a data bandwidth of up to 500M words per second (-4). To fully comply with the personal computer industrial standard, W9425G6DH is sorted into four speed grades: -4, -5, -6 and -75. The -4 is compliant to the DDR500/CL3 specification. The -5 is compliant to the DDR400/CL3 specification. The -6 is compliant to the DDR333/CL2.5 specification (the -6I grade which is guaranteed to support -40°C ~ 85°C). The -75 is compliant to the DDR266/CL2 specification (the 75I grade which is guaranteed to support -40°C ~ 85°C).

FEATURES

• 2.5V ±0.2V Power Supply for DDR266/DDR333
• 2.6V ±0.1V Power Supply for DDR400/DDR500
• Up to 250 MHz Clock Frequency
• Double Data Rate architecture; two data transfers per clock cycle
• Differential clock inputs (CLK and CLK )
• DQS is edge-aligned with data for Read; center-aligned with data for Write
• CAS Latency: 2, 2.5 and 3
• Burst Length: 2, 4 and 8
• Auto Refresh and Self Refresh
• Precharged Power Down and Active Power Down
• Write Data Mask
• Write Latency = 1
• 7.8µS refresh interval (8K / 64 mS refresh)
• Maximum burst refresh cycle: 8
• Interface: SSTL_2
• Packaged in TSOP II 66-pin, 400 mil, 0.65 mm pin pitch, using Pb free with RoHS compliant

Specifications

Attribute Attribute Value
Manufacturer Winbond Electronics
Product Category Memory ICs
Series -
Packaging Tray Alternate Packaging
Package-Case 60-TFBGA
Operating-Temperature -40°C ~ 85°C (TA)
Interface Parallel
Voltage-Supply 1.7 V ~ 1.95 V
Supplier-Device-Package 60-VFBGA (8x9)
Memory Capacity 512M (32M x 16)
Memory-Type Mobile LPDDR SDRAM
Speed 200MHz
Format-Memory RAM

Descriptions

SDRAM - Mobile LPDDR Memory IC 512Mb (32M x 16) Parallel 200MHz 5ns 60-VFBGA (8x9)
DRAM Chip Mobile LPDDR SDRAM 512Mbit 32Mx16 1.8V 60-Pin VFBGA
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