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S29GL01GS11FHIV23 IC FLASH 1GBIT PARALLEL 64FBGA Infineon Technologies

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S29GL01GS11FHIV23 IC FLASH 1GBIT PARALLEL 64FBGA Infineon Technologies

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Brand Name :Infineon Technologies
Model Number :S29GL01GS11FHIV23
MOQ :1
Price :Based on current price
Payment Terms :T/T
Supply Ability :In stock
Delivery Time :3-5 work days
Packaging Details :anti-static bag & cardboard box
Memory Type :Non-Volatile
Memory Format :FLASH
Technology :FLASH - NOR
Memory Size :1Gbit
Memory Organization :64M x 16
Memory Interface :Parallel
Clock Frequency :-
Write Cycle Time - Word, Page :60ns
Access Time :110 ns
Voltage - Supply :1.65V ~ 3.6V
Operating Temperature :-40°C ~ 85°C (TA)
Mounting Type :Surface Mount
Package / Case :64-LBGA
Supplier Device Package :64-FBGA (13x11)
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Product Details

GL-S MirrorBit® Eclipse™ Flash Non-Volatile Memory Family

S29GL01GS 1 Gbit (128 Mbyte)
S29GL512S 512 Mbit (64 Mbyte)
S29GL256S 256 Mbit (32 Mbyte)
S29GL128S 128 Mbit (16 Mbyte)
CMOS 3.0 Volt Core with Versatile I/O

General Description

The Spansion® S29GL01G/512/256/128S are MirrorBit Eclipse flash products fabricated on 65 nm process technology. These devices offer a fast page access time as fast as 15 ns with a corresponding random access time asfast as 90 ns. They feature a Write Buffer that allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting infaster effective
programming time than standard programming algorithms. Thismakes these devices ideal for today’s embedded applications that require higher density, better performance and lower power consumption.

Distinctive Characteristics

65 nm MirrorBit Eclipse Technology
Single supply (VCC) for read / program / erase (2.7V to 3.6V)
Versatile I/O Feature
– Wide I/O voltage range (VIO): 1.65V to VCC
x16 data bus
Asynchronous 32-byte Page read
512-byte Programming Buffer
– Programming in Page multiples, up to a maximum of 512 bytes
Single word and multiple program on same word options
Sector Erase
– Uniform 128-kbyte sectors
Suspend and Resume commands for Program and Erase operations
Status Register, Data Polling, and Ready/Busy pin methods to determine device status
Advanced Sector Protection (ASP)
– Volatile and non-volatile protection methods for each sector
Separate 1024-byte One Time Program (OTP) array with two lockable regions
Common Flash Interface (CFI) parameter table
Temperature Range
– Industrial (-40°C to +85°C)
– In-Cabin (-40°C to +105°C)
100,000 erase cycles for any sector typical
20-year data retention typical
Packaging Options
– 56-pin TSOP
– 64-ball LAA Fortified BGA, 13 mm x 11 mm
– 64-ball LAE Fortified BGA, 9 mm x 9 mm
– 56-ball VBU Fortified BGA, 9 mm x 7 mm

Specifications

Attribute Attribute Value
Manufacturer Cypress Semiconductor
Product Category Memory ICs
Series GL-S
Packaging Tape & Reel (TR) Alternate Packaging
Package-Case 64-LBGA
Operating-Temperature -40°C ~ 85°C (TA)
Interface Parallel
Voltage-Supply 1.65 V ~ 3.6 V
Supplier-Device-Package 64-Fortified BGA (13x11)
Memory Capacity 1G (64M x 16)
Memory-Type FLASH - NOR
Speed 110ns
Format-Memory FLASH
Functional compatible componentForm,Package,Functional compatible component
Manufacturer Part# Description Manufacturer Compare
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Descriptions

FLASH - NOR Memory IC 1Gb (64M x 16) Parallel 110ns 64-Fortified BGA (13x11)
NOR Flash Parallel 3V/3.3V 1G-bit 64M x 16 110ns 64-Pin Fortified BGA T/R
Flash Memory 1G BIT, 3V, 110NS, 64-BALL FBGA, PAGE MODE FLASH MEMORY FEATURING 65 NM MIRRORBIT PROCESS TECHNOLOGY, VIO, LOWEST ADDRESS SECTOR PROTECTED
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